CTIA Tungsten Needle in Focused Ion Beam and Micro/Nano Fabrication
CTIA tungsten needle plays a critical role in Focused Ion Beam (FIB) and micro/nano fabrication systems, where tip geometry, material stability, and mechanical performance directly determine ion emission behavior and processing accuracy. With high melting point, low vapor pressure, and excellent structural stability, tungsten provides a reliable base for Liquid Metal Ion Source (LMIS). CTIA ensures consistent tip geometry and microstructure through purity control, grain refinement, and precision tip forming.
In Focused Ion Beam (FIB) systems, tungsten needles act as the base of the liquid metal ion source. Molten metals such as gallium wet the tip and form a Taylor cone under high electric fields, enabling stable ion emission. Tip geometry directly influences beam brightness, symmetry, and spot size, typically achieving 5–10 nm resolution for chip cross-sectioning and defect analysis.
Tungsten’s high purity and uniform grain structure reduce emission noise and stabilize ion output under 20–30 kV operation and strong electric fields. Its thermal stability maintains tip morphology, ensuring consistent emission position and extended service life.
2. Tungsten Needle for FIB (Focused Ion Beam) Lift-outFocused Ion Beam (FIB) lift-out is used for Transmission Electron Microscopy (TEM) sample preparation and semiconductor cross-section analysis, requiring precise manipulation under combined electrical and mechanical loading. The tungsten needle serves as a micro-tool, directly affecting positioning accuracy and repeatability.
With high elastic modulus and structural uniformity, tungsten needles maintain micron-level tip precision under prolonged high-field and localized heating conditions. This prevents bending or fracture, enabling accurate and repeatable sample extraction.
3. Tungsten Needle for IBID (Ion Beam Induced Deposition)Ion Beam Induced Deposition (IBID) uses a focused ion beam to decompose precursor gases and deposit nanoscale structures, typically with line widths of 10–100 nm. Stable ion emission and consistent beam characteristics are essential for controlling deposition accuracy.
Tungsten’s low surface diffusion suppresses atomic migration at the tip, maintaining Taylor cone stability and ensuring uniform deposition thickness. High material purity reduces current noise and beam fluctuation, improving repeatability and pattern consistency.
Ion Beam Induced Etching (IBIE) removes material through ion-induced reactions or sputtering, requiring precise beam control and stable emission. Tip geometry directly affects etching resolution and microstructure integrity.
Tungsten needles maintain consistent tip morphology under high electric field and localized thermal loads due to their high strength and thermal stability. CTIA improves grain uniformity to enhance line width control and ensure reliable nanoscale etching performance.
5. Tungsten Needle for NanofabricationNanofabrication and Micro-Electro-Mechanical Systems (MEMS) processing require ultra-fine tips, often below 100 nm, for precise structure definition and manipulation. Tip stability is critical for maintaining processing accuracy.
Tungsten needles offer high thermal resistance and structural stability, preventing tip deformation during continuous operation. CTIA controls tip radius (50–80 nm) and coaxiality (≤0.5 μm) to achieve consistent nanoscale machining and sample preparation.
6. Tungsten Needle for Integrated Circuit (IC) RepairIn integrated circuit repair, tungsten needles are used for precise ion beam cutting and localized micro-welding, where stable emission and geometric consistency are essential. High-purity tungsten ensures uniform current distribution and stable emission performance. Its mechanical strength and resistance to thermal degradation prevent deformation or erosion, ensuring precision and reliability in Integrated Circuit (IC) repair processes.
Tungsten needles enable high-resolution, stable, and repeatable micro/nano processing through precise geometry, high material purity, and controlled microstructure. With excellent thermal stability, mechanical strength, and dimensional consistency, CTIA tungsten needles meet the demanding requirements of advanced semiconductor and micro/nano fabrication systems, ensuring long-term reliability and process stability.
If there is any interest in tungsten products, please feel free to contact us through the following methods.
Email: sales@chinatungsten.com
Tel.: +86 592 512 9696/+86 592 512 9595
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