Tungsten Crucible in Electron Beam Evaporation
Tungsten crucible in electron beam evaporation refers to high-temperature evaporation vessel deployed in electron beam evaporation coating equipment. It holds metals, oxides, and high-melting-point materials within high-vacuum environments, enabling stable evaporation under electron beam bombardment heating conditions to deliver high-purity, stable material sources for thin film deposition.
Tungsten crucible is manufactured from high-purity tungsten material with minimum tungsten content of 99.95% through powder metallurgy sintering and precision machining processes, making components compatible with advanced electron beam evaporation and functional thin film deposition systems.
Why Use Tungsten Crucible in Electron Beam Evaporation?
Evaporation vessels in electron beam evaporation processes must endure localized heating from high-energy electron beams and high-temperature thermal shocks over extended operations. Consequently, materials must possess extremely high melting points, high-temperature mechanical strength, and reliable vacuum performance capabilities. CTIA’s tungsten crucible exhibits specific characteristics to satisfy evaporation vessel requirements in electron beam evaporation applications:
（1）High Temperature Resistance: Melting point of approximately 3410°C accommodates high-melting-point evaporation materials.
（2）Low Vapor Pressure: Low volatilization within high-vacuum environments reduces thin film contamination risks.
（3）High Temperature Strength: Structural stability is maintained under localized high-temperature electron beam bombardment.
（4）Thermal Shock Resistance: Performance remains stable during rapid temperature elevation and cyclic thermal operations.
（5）Stable Thermal Conductivity: Temperature uniformity within evaporation zones is maintained to enhance evaporation stability.
（6）High Material Purity: Impurity introduction is minimized to increase thin film purity and deposition quality.
Applications of CTIA’s Tungsten Crucible in Electron Beam Evaporation
（1）Semiconductor thin film deposition (conductive layers, functional layers, electrode layers)
（2）Optical coating (anti-reflective films, reflective films, optical filters)
（3）Metal evaporation (Al, Au, Ag, Ti, and associated metals)
（4）High-melting-point oxide evaporation deposition
（5）OLED (Organic Light Emitting Diode) functional layer evaporation
（6）Advanced functional coatings and research thin film preparation
Specifications of CTIA's Tungsten Crucibles
（1）Purity: ≥ 99.95%
（2）Density: 17.8 - 18.5 g/cm³
（3）Outer Diameter: 10 - 300 mm, customizable
（4）Height: 10 - 400 mm, customizable
（5）Wall Thickness: 0.5 - 20 mm, customizable
CTIA GROUP has focused on tungsten crucible manufacturing for more than 30 years, offering customized optimization of crucible dimensions, wall thickness distribution, and heat zone design for electron beam evaporation systems, supported by integrated manufacturing and precision machining capabilities.
For any inquiry, please contact tungsten crucible manufacturer: CTIA GROUP
Email: sales@chinatungsten.com
Tel: 0086 592 5129696 / 0086 592 5129595
Website: www.tungsten.com.cn
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